O Graudejus, T. Li, J. Cheng, N. Keiper, R.D. Ponce Wong, A.B. Pak, J. Abbas, The effects of bending on the resistance of elastically stretchable metal conductors, and a comparison with stretching. Applied Physics Letters, 2017, 110, 221906 (Click Here)

W. H. Kang, W. Cao, O. Graudejus, T. Patel, S. Wagner, D. Meaney, B. Morrison III, Alterations in Hippocampal Network Activity after In Vitro Traumatic Brain Injury, Journal of Neurotrauma, 2015, 32(13), 1011-1019 (Click Here)

O. Graudejus, Z. Jia, T. Li, S. Wagner, Size dependent rupture strain of elastically stretchable metal conductors, Scripta Materialia, 2012, 66, 919-922 (Click Here)

O. Graudejus, B. Morrison, C. Goletiani, Z. Yu, S. Wagner, Encapsulating elastically stretchable neural interfaces: yield, resolution, and recording/stimulation of neural activity, Advanced Functional Materials, 2012, 22, 640-651 (Click Here)

J. Jones, O. Graudejus, S. Wagner, Elastically stretchable insulation and bi-level metallization and its application in a stretchable RLC circuit, Journal of Electronic Materials, 2011, 40(6), 1335-1344. (Click Here)

O. Graudejus, P. Görrn, S. Wagner, Controlling the morphology of gold films on poly(dimethylsiloxane), ACS Applied Materials & Interfaces, 2010, 2(7), 1927-1933 (Click Here)

S. P. Lacour, S. Benmerah, E. Tarte, J. FitzGerald, J. Serra, S. McMahon, J. Fawcett, O. Graudejus, Z. Yu, B Morrison, Flexible and stretchable micro-electrodes for in vitro and in vivo neural interfaces, Medical & Biological Engineering Computation, 2010, 48(10), 945-954 (Special Issue) (Click Here)

Z. Yu, O. Graudejus, C. Tsay, S. P. Lacour, S. Wagner, B. Morrison, Monitoring hippocampus electrical activity in vitro on an elastically deformable microelectrode array, Journal of Neurotrauma, 2009, 26(7), 1135-1145 (Click Here)

O. Graudejus, Z. Yu, J. Jones, B. Morrison III, S. Wagner, Characterization of an elastically stretchable microelectrode array and its application to neural field potential recordings, Journal of the Electrochemical Society, 2009, 156(6) P85-P94 (Click Here)



  • BMSEED has an exclusive license agreement for the core technology with Princeton University (US Patent 7,491,892)

  • Non-provisional patent application filed for the application of microcracked gold in resistive pressure sensors